Invention Grant
- Patent Title: Liquid coverlays for flexible printed circuit boards
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Application No.: US13256619Application Date: 2010-03-16
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Publication No.: US09670306B2Publication Date: 2017-06-06
- Inventor: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
- Applicant: Stephen Anthony Hall , Richard Charles Davis , Simon Richard Ford , Matthias Klaus , Karl-Heinz Ognibeni
- Applicant Address: US NJ Parsippany
- Assignee: Sun Chemical Corporation
- Current Assignee: Sun Chemical Corporation
- Current Assignee Address: US NJ Parsippany
- Agency: Frost Brown Todd LLC
- International Application: PCT/GB2010/050449 WO 20100316
- International Announcement: WO2010/106359 WO 20100923
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C09J177/08 ; C08G18/34 ; C08G18/80 ; C09D179/08 ; H05K3/28 ; C08L63/00 ; H01B3/30 ; H05K1/03
Abstract:
The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
Public/Granted literature
- US20120000696A1 LIQUID COVERLAYS FOR FLEXIBLE PRINTED CIRCUIT BOARDS Public/Granted day:2012-01-05
Information query
IPC分类:
