Invention Grant
- Patent Title: Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
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Application No.: US15351151Application Date: 2016-11-14
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Publication No.: US09670340B2Publication Date: 2017-06-06
- Inventor: Sang A Ju , Hyun Gu Im , Jae Man Park
- Applicant: LG Innotek Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2015-0014570 20150129
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08K9/02 ; C08K3/22
Abstract:
An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
Public/Granted literature
- US20170058107A1 INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME Public/Granted day:2017-03-02
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