Invention Grant
- Patent Title: Moisture-curable polyurethane hot-melt resin composition, adhesive, and article
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Application No.: US14352017Application Date: 2012-10-11
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Publication No.: US09670391B2Publication Date: 2017-06-06
- Inventor: Yoshinori Kanagawa , Toyokuni Fujiwara , Ryou Nonaka
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC CORPORATION
- Current Assignee: DIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-232889 20111024
- International Application: PCT/JP2012/076312 WO 20121011
- International Announcement: WO2013/061790 WO 20130502
- Main IPC: C09J175/06
- IPC: C09J175/06 ; C09J175/04 ; C08G18/76 ; C08G18/40 ; C08G18/42 ; C08G18/48 ; C08G18/62

Abstract:
It is an object of the present invention to provide a moisture-curable polyurethane hot-melt resin composition having excellent waterproof properties, drop impact resistance, and flexibility. The present invention provides a moisture-curable polyurethane hot-melt resin composition containing a urethane prepolymer having an isocyanate group, the urethane prepolymer being produced through a reaction of a polyol (A) with a polyisocyanate (B), wherein the polyol (A) contains a polyether polyol (A-1), a crystalline polyester polyol (A-2), an amorphous polyester polyol (A-3), and an acrylic polyol (A-4). The present invention also provides an adhesive containing such a composition and an article in which such a composition is used.
Public/Granted literature
- US20140242396A1 MOISTURE-CURABLE POLYURETHANE HOT-MELT RESIN COMPOSITION, ADHESIVE, AND ARTICLE Public/Granted day:2014-08-28
Information query
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