Invention Grant
- Patent Title: Production method of epitaxial silicon wafer and vapor deposition apparatus
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Application No.: US14855943Application Date: 2015-09-16
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Publication No.: US09670581B2Publication Date: 2017-06-06
- Inventor: Motoki Goto , Yusuke Kurozumi , Kan Yoshitake , Hitoshi Takamiya
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-191580 20140919
- Main IPC: H01L21/20
- IPC: H01L21/20 ; C23C16/44 ; H01L29/36 ; C30B25/08 ; C30B29/06

Abstract:
A method for producing an epitaxial silicon wafer by applying a vapor deposition on a silicon wafer is disclosed. A vapor deposition apparatus in which the vapor deposition is conducted at least includes a chamber and a hydrogen-chloride-gas supply apparatus that is in communication and connected with an inside of the chamber to supply hydrogen chloride gas into the chamber. A valve including a diaphragm that allows or blocks a flow of the hydrogen chloride gas from an inlet channel to an outlet channel is disposed in the hydrogen-chloride-gas supply apparatus. A W-free anticorrosion alloy material is used for the diaphragm. When a maintenance work is to be done inside the chamber, the hydrogen chloride gas is supplied from the hydrogen-chloride-gas supply apparatus into the chamber.
Public/Granted literature
- US20160083836A1 PRODUCTION METHOD OF EPITAXIAL SILICON WAFER AND VAPOR DEPOSITION APPARATUS Public/Granted day:2016-03-24
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