Invention Grant
- Patent Title: Thermoelectric cooling packages and thermal management methods thereof
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Application No.: US14961167Application Date: 2015-12-07
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Publication No.: US09671141B2Publication Date: 2017-06-06
- Inventor: Jae Choon Kim , Jichul Kim , Jin-Kwon Bae , Eunseok Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0127818 20111201
- Main IPC: F25B21/00
- IPC: F25B21/00 ; F25B21/02 ; H01L35/32
Abstract:
A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.
Public/Granted literature
- US20160084542A1 THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF Public/Granted day:2016-03-24
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