Invention Grant
- Patent Title: Liquid-cooled-type cooling device
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Application No.: US12350441Application Date: 2009-01-08
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Publication No.: US09671179B2Publication Date: 2017-06-06
- Inventor: Shogo Mori , Hideyasu Obara , Taizo Kuribayashi , Shinobu Tamura
- Applicant: Shogo Mori , Hideyasu Obara , Taizo Kuribayashi , Shinobu Tamura
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-005506 20080115; JP2008-077298 20080325
- Main IPC: H01L23/473
- IPC: H01L23/473 ; F28F3/12 ; F28F9/02

Abstract:
A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet, and an outflow pipe connected to the cooling-liquid outlet. The casing includes a cooling-liquid outflow portion, and the cooling-liquid outlet is formed in a top wall of the cooling-liquid outflow portion. The outflow pipe has a bottom wall parallel to a portion of the top wall of the cooling-liquid outflow portion where the cooling-liquid outlet is formed. The bottom wall has a through hole for communication with the cooling-liquid outlet. A guide portion is provided on a portion of an upper surface of a bottom wall of the cooling-liquid outflow portion, the portion corresponding to the cooling-liquid outlet, so as to change, toward an upward direction, the flow direction of cooling liquid flowing into the cooling-liquid outflow portion. Thus, a flow resistance which cooling liquid undergoes when flowing out of the casing can be reduced.
Public/Granted literature
- US20090178792A1 LIQUID-COOLED-TYPE COOLING DEVICE Public/Granted day:2009-07-16
Information query
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