Invention Grant
- Patent Title: Wafer to wafer alignment
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Application No.: US14576072Application Date: 2014-12-18
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Publication No.: US09671215B2Publication Date: 2017-06-06
- Inventor: Mukta G. Farooq , John A. Fitzsimmons , Spyridon Skordas
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Law Offices of Ira D. Blecker, P.C.
- Main IPC: G01B7/31
- IPC: G01B7/31 ; H01L21/66 ; H01L23/544

Abstract:
Wafer to wafer alignment which includes a first semiconductor wafer and a second semiconductor wafer. The first and second semiconductor wafers have selectively-activated alignment arrays for aligning the first semiconductor wafer with the second semiconductor wafer. Each of the alignment arrays include an alignment structure which includes an antenna connected to a semiconductor device. The antenna in each of the alignment arrays is selectively activated to act as a charge source or as a charge sensing receptor. The alignment arrays are located in the kerf areas of the semiconductor wafers. The semiconductor wafers are aligned when the charge sources on one semiconductor wafer match with the charge sensing receptors on the other semiconductor wafer.
Public/Granted literature
- US20160178344A1 WAFER TO WAFER ALIGNMENT Public/Granted day:2016-06-23
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