- Patent Title: Substrate inspection apparatus and probe card transferring method
-
Application No.: US14591148Application Date: 2015-01-07
-
Publication No.: US09671452B2Publication Date: 2017-06-06
- Inventor: Takashi Amemiya
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-001651 20140108
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/26 ; G01R31/28 ; G01R31/27

Abstract:
A wafer inspection apparatus 10 includes a middle plate 22 that mounts a probe card 18 in which multiple contact probes 20 are provided; a drawer type table 21 in which the middle plate 22 is provided; a tester 15 to which the probe card 18 is mounted; and a transfer robot 17 that transfers the middle plate 22. The middle plate 22 includes a base 23 and multiple supports 24 protruding toward the probe card 18 to be mounted. A protruding height of each support 24 is equal to or higher than a protruding length of the contact probe 20 from the probe card 18. The probe card 18 is fastened to a probe card cover 29 when the probe card 18 is mounted on the middle plate 22, and the transfer robot 17 transfers the middle plate 22 from the table 21 to the tester 15.
Public/Granted literature
- US20150192607A1 SUBSTRATE INSPECTION APPARATUS AND PROBE CARD TRANSFERRING METHOD Public/Granted day:2015-07-09
Information query