Invention Grant
- Patent Title: Ultrasonic micron precision molding apparatus
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Application No.: US14736680Application Date: 2015-06-11
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Publication No.: US09671774B2Publication Date: 2017-06-06
- Inventor: Chen-Chia Chou , I-Wei Su , Hao-Yen Liao , Kuei-Chih Feng
- Applicant: Chen-Chia Chou
- Applicant Address: TW Taipei
- Assignee: Chen-Chia Chou
- Current Assignee: Chen-Chia Chou
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW103128738A 20140821
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B06B1/02 ; B29C65/00 ; B29C65/08 ; B32B37/00 ; B23B21/00 ; G05B19/18 ; B23D7/06 ; B28D5/04 ; B23D5/00 ; B06B3/00

Abstract:
An ultrasonic micron precision molding apparatus includes: an ultrasonic generating module, a tool and an amplitude transformer. The ultrasonic generating module provides ultrasonic frequency vibration. The tool is disposed below the ultrasonic generating module, and has a micron-level precision structure. The amplitude transformer is disposed between the ultrasonic generating module and the tool and has a first section and a second section, the first section is disposed at the junction of the amplitude transformer and the tool, and the distance between the second section and the tool is longer than the distance between the first section and the tool, wherein the width of the first section is greater than the width of the second section.
Public/Granted literature
- US20160052066A1 ULTRASONIC MICRON PRECISION MOLDING APPARATUS Public/Granted day:2016-02-25
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