Invention Grant
- Patent Title: Touch module and touch panel
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Application No.: US14160561Application Date: 2014-01-22
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Publication No.: US09671907B2Publication Date: 2017-06-06
- Inventor: I-Chung Hsu , Kuo-Shu Hsu
- Applicant: TPK Touch Solutions (Xiamen) Inc.
- Applicant Address: CN Xiamen
- Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee: TPK Touch Solutions (Xiamen) Inc.
- Current Assignee Address: CN Xiamen
- Agency: Cooper Legal Group, LLC
- Priority: CN201310033137 20130128
- Main IPC: G06F3/044
- IPC: G06F3/044

Abstract:
A touch module and a touch panel comprising the same are provided. The touch panel comprises a substrate and a touch module disposed on the substrate. The touch module comprises a first conductive element, a second conductive element, and a dielectric element disposed between the first conductive element and the second conductive element, whereby the first conductive element are electrically insulated from the second conductive element. The dielectric element has a thickness equal to or less than 1 micrometer, and thereby it is beneficial to achieve miniaturization of the touch panel.
Public/Granted literature
- US20140210778A1 TOUCH MODULE AND TOUCH PANEL Public/Granted day:2014-07-31
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