A device is described. In an example, a device comprises a capacitance sensor layer and a conductive grounded layer. The conductive grounded layer is placed under the capacitance sensor layer in a direction opposite to a targeted sensing direction of the device. The distance between the capacitance sensor layer and the conductive grounded layer is configured to remain within a threshold over a range of deformation. In other examples, a method for manufacturing a device and a module are discussed along with the features of the device.