Invention Grant
- Patent Title: Tiered sub-unit throughputs in mass storage assemblies
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Application No.: US14558329Application Date: 2014-12-02
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Publication No.: US09671959B2Publication Date: 2017-06-06
- Inventor: Curtis H. Bruner , Christopher J. Squires
- Applicant: HGST NETHERLANDS B.V.
- Applicant Address: US CA Irvine
- Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee Address: US CA Irvine
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F3/06

Abstract:
Tiered mass storage assemblies are presented. The mass storage assembly in one example includes a plurality of drive interfaces configured to couple to a plurality of storage devices, with each drive interface of the plurality of drive interfaces being configured to exchange digital data at a predetermined maximum interface throughput, one or more low-output storage drives coupled to one or more corresponding drive interfaces, with a low-output storage drive exchanging digital data using the predetermined maximum interface throughput, and one or more high-output storage drives, with each high-output storage drive of the one or more high-output storage drives being coupled to two or more drive interfaces and with a high-output storage drive exchanging digital data using two or more predetermined maximum interface throughputs of the two or more drive interfaces.
Public/Granted literature
- US20160154609A1 TIERED SUB-UNIT THROUGHPUTS IN MASS STORAGE ASSEMBLIES Public/Granted day:2016-06-02
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