• Patent Title: Fingerprint indentification apparatus and manufactureing metheod thereof
  • Application No.: US14555718
    Application Date: 2014-11-28
  • Publication No.: US09672402B2
    Publication Date: 2017-06-06
  • Inventor: Juan Wang
  • Applicant: MiiCs & Partners Inc.
  • Applicant Address: VG Road Town
  • Assignee: MiiCs & Partners Inc.
  • Current Assignee: MiiCs & Partners Inc.
  • Current Assignee Address: VG Road Town
  • Agent Zhigang Ma
  • Priority: CN201410678986 20141124
  • Main IPC: G06K9/00
  • IPC: G06K9/00
Fingerprint indentification apparatus and manufactureing metheod thereof
Abstract:
A fingerprint identification apparatus includes a fingerprint identification module and a signal transmitting module electrically connected to the fingerprint identification module. The signal transmitting module includes a loading substrate and a first sensing layer with a plurality of first sensing units. The first sensing units are located on the loading substrate in a matrix. Each corner of the first sensing units is a substantially arc shaped.
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