Invention Grant
- Patent Title: Fingerprint indentification apparatus and manufactureing metheod thereof
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Application No.: US14555718Application Date: 2014-11-28
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Publication No.: US09672402B2Publication Date: 2017-06-06
- Inventor: Juan Wang
- Applicant: MiiCs & Partners Inc.
- Applicant Address: VG Road Town
- Assignee: MiiCs & Partners Inc.
- Current Assignee: MiiCs & Partners Inc.
- Current Assignee Address: VG Road Town
- Agent Zhigang Ma
- Priority: CN201410678986 20141124
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A fingerprint identification apparatus includes a fingerprint identification module and a signal transmitting module electrically connected to the fingerprint identification module. The signal transmitting module includes a loading substrate and a first sensing layer with a plurality of first sensing units. The first sensing units are located on the loading substrate in a matrix. Each corner of the first sensing units is a substantially arc shaped.
Public/Granted literature
- US20160148032A1 FINGERPRINT INDENTIFICATION APPARATUS AND MANUFACTUREING METHEOD THEREOF Public/Granted day:2016-05-26
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