A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped shaped laminate in which a ceramic layer and an internal electrode are alternately laminated and an external electrode provided on a portion of a surface of the laminate and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the laminate and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes, as a metal component, a first metal component of which a portion forms an alloy with the internal electrode so as to connect the internal electrode and the inner external electrode to each other, and a second metal component higher in melting point than the first metal component, of which a portion forms an alloy with the first metal component so as to connect the inner external electrode and the outer external electrode to each other. A concentration of a metal in a surface layer of the inner external electrode is not lower than about 17%.