Invention Grant
- Patent Title: Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
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Application No.: US15019318Application Date: 2016-02-09
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Publication No.: US09673109B2Publication Date: 2017-06-06
- Inventor: Eung San Cho , Andrew N. Sawle , Mark Pavier , Daniel Cutler
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/84 ; H01L25/00 ; H01L23/495 ; H01L25/18 ; H01L23/00 ; H01L25/07 ; H01L25/11 ; H01L25/16 ; H01L23/31 ; H01L21/56
Abstract:
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the semiconductor package to a mounting surface. The semiconductor package also includes a control FET of a power converter switching stage having a control drain attached to the die side of the control conductive carrier. The control conductive carrier is configured to sink heat produced by the control FET into the mounting surface. The semiconductor package includes a sync conductive carrier having another die side and another opposite I/O side connecting the semiconductor package to the mounting surface, and a sync FET of the power converter switching stage having a sync source attached to the die side of the sync conductive carrier.
Public/Granted literature
- US20160155674A1 Fabricating a Semiconductor Package with Conductive Carrier Public/Granted day:2016-06-02
Information query
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