Invention Grant
- Patent Title: Power module and method of manufacturing power module
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Application No.: US15038590Application Date: 2014-07-31
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Publication No.: US09673118B2Publication Date: 2017-06-06
- Inventor: Masaki Taya
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-243924 20131126
- International Application: PCT/JP2014/004028 WO 20140731
- International Announcement: WO2015/079600 WO 20150604
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/053 ; H01L25/07 ; H01L25/18 ; H01L23/373 ; H01L23/498 ; H01L21/48 ; H01L23/29 ; H01L23/31 ; H01L23/535 ; H01L23/24 ; H01L23/00
Abstract:
A power module providing an improved manufacture yield and having an ensured stable joint strength and accordingly improved reliability is provided. The power module includes: a base portion having one surface on which an electrode portion is formed; a conductor portion disposed to face the one surface of the base portion on which the electrode portion is formed, for making electrical connection with the outside; and an interconnect portion connected to the electrode portion formed on the one surface of the base portion and to the surface of the conductor portion facing the one surface of the base portion for electrically connecting the electrode portion to the conductor portion.
Public/Granted literature
- US20160300770A1 POWER MODULE AND METHOD OF MANUFACTURING POWER MODULE Public/Granted day:2016-10-13
Information query
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