Invention Grant
- Patent Title: Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same
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Application No.: US14706663Application Date: 2015-05-07
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Publication No.: US09673120B2Publication Date: 2017-06-06
- Inventor: Sang Jin Kim , Eun Jung Lee , Yong Han Cho
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-Si, Gyeonggi-Do
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2014-0128685 20140925
- Main IPC: H01L23/28
- IPC: H01L23/28 ; C08L83/00 ; C08G77/20 ; H01L23/29 ; C08L63/04 ; H01L23/00 ; H01L33/56 ; C09D163/04
Abstract:
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:
Public/Granted literature
Information query
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