Invention Grant
- Patent Title: Electronic device module and method of manufacturing the same
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Application No.: US14858275Application Date: 2015-09-18
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Publication No.: US09673123B2Publication Date: 2017-06-06
- Inventor: Seung Yong Choi
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0125174 20140919; KR10-2015-0010201 20150121
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/48 ; H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L23/538
Abstract:
The electronic device module includes a sealing part sealing an electronic component therein, and an external connection terminal disposed on one surface of the sealing part. The electronic device module also includes a dummy bonding part configured on a surface of the sealing part and spaced apart from the external connection terminal.
Public/Granted literature
- US20160086866A1 ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-03-24
Information query
IPC分类:
