Invention Grant
- Patent Title: Bonded structures for package and substrate
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Application No.: US15212970Application Date: 2016-07-18
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Publication No.: US09673161B2Publication Date: 2017-06-06
- Inventor: Ming-Hong Cha , Chen-Shien Chen , Chen-Cheng Kuo , Tsung-Hsien Chiang , Hao-Juin Liu , Yao-Chun Chuang , Chita Chuang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L21/768 ; H01L25/065
Abstract:
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.
Public/Granted literature
- US20160329293A1 Bonded Structures for Package and Substrate Public/Granted day:2016-11-10
Information query
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