Invention Grant
- Patent Title: Array substrate of organic light-emitting diodes and method for packaging the same
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Application No.: US14667621Application Date: 2015-03-24
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Publication No.: US09673180B2Publication Date: 2017-06-06
- Inventor: Yujun Li
- Applicant: Shanghai Tianma AM-OLED Co., Ltd. , Tianma Micro-Electronics Co., Ltd.
- Applicant Address: CN Shanghai CN Shenzhen
- Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.,TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.,TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee Address: CN Shanghai CN Shenzhen
- Agency: Anova Law Group, PLLC
- Priority: CN201410822726 20141222
- Main IPC: H01L25/10
- IPC: H01L25/10 ; H01L51/56 ; H01L25/00 ; H01L25/04 ; H01L51/52 ; H01L27/32

Abstract:
An array substrate of organic light-emitting diodes and a method for fabricating the same are provided to narrow an edge frame of product device of organic light-emitting diodes, to shorten the package process time, and to improve the substrate utilization and the production efficiency. The array substrate of organic light-emitting diodes includes a plurality of display panels disposed in an array of rows and columns, wherein at least two adjacent display panels are connected through a frame adhesive, and there is no cutting headroom between at least one side of the at least two adjacent display panels.
Public/Granted literature
- US20160181230A1 ARRAY SUBSTRATE OF ORGANIC LIGHT-EMITTING DIODES AND METHOD FOR PACKAGING THE SAME Public/Granted day:2016-06-23
Information query
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