Invention Grant
- Patent Title: Semiconductor device including a gate trench having a gate electrode located above a buried electrode
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Application No.: US14995049Application Date: 2016-01-13
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Publication No.: US09673318B1Publication Date: 2017-06-06
- Inventor: Ashita Mirchandani , Timothy D. Henson
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/40 ; H01L29/06 ; H01L29/10 ; H01L29/08 ; H01L29/417

Abstract:
A semiconductor device includes a semiconductor substrate having a base region situated over a drift region, a source trench extending through the base region and into the drift region, the source trench having a shield electrode, a gate trench extending through the base region and into the drift region, the gate trench adjacent the source trench, the gate trench having a gate electrode situated above a buried electrode. The source trench is surrounded by the gate trench. The shield electrode is coupled to a source contact over the semiconductor substrate. The semiconductor device also includes a source region over the base region. The gate trench includes gate trench dielectrics lining a bottom and sidewalls of the gate trench. The source trench includes source trench dielectrics lining a bottom and sidewalls of the source trench.
Information query
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