Invention Grant
- Patent Title: Semiconductor component and process for fabricating a semiconductor component
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Application No.: US14420814Application Date: 2013-08-12
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Publication No.: US09673350B2Publication Date: 2017-06-06
- Inventor: Francois Boulard , Olivier Gravrand
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
- Applicant Address: FR Paris
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1257810 20120814
- International Application: PCT/EP2013/066779 WO 20130812
- International Announcement: WO2014/026941 WO 20140220
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/00 ; H01L33/46 ; H01L33/62 ; H01L27/146

Abstract:
A semi-conducting component including a semi-conducting layer of a first conductivity type including a plurality of semi-conducting zones of a second conductivity type opposite that of the semi-conducting layer, and an insulating layer. The component further includes a first bias mechanism configured to bias the semi-conducting layer and a second bias mechanism configured to bias a semi-conducting zone. The first bias mechanism includes a conducting layer in contact with the insulating layer and which includes passageways for each second bias mechanism with the spacing between the conducting layer and the second bias mechanism which is located facing the corresponding semi-conducting zone.
Public/Granted literature
- US20150207027A1 SEMICONDUCTOR COMPONENT AND PROCESS FOR FABRICATING A SEMICONDUCTOR COMPONENT Public/Granted day:2015-07-23
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