Invention Grant
- Patent Title: Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
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Application No.: US15241264Application Date: 2016-08-19
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Publication No.: US09673646B1Publication Date: 2017-06-06
- Inventor: Kuei-Sen Cheng , Yao-Sheng Lai
- Applicant: Chang Chun Petrochemical Co., Ltd.
- Applicant Address: TW Taipei
- Assignee: Chang Chun Petrochemical Co., Ltd.
- Current Assignee: Chang Chun Petrochemical Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Polsinelli PC
- Main IPC: B21C37/02
- IPC: B21C37/02 ; H02J7/00 ; C23F1/00 ; C23F17/00 ; C22F1/08 ; B29C65/00 ; B29C65/18 ; C25D1/04 ; C25D1/20 ; C25D3/12 ; C25D3/22 ; C25D9/04 ; H02J7/02 ; H02J50/10 ; H05K3/20 ; B29K79/00 ; B29L9/00 ; B29L31/34

Abstract:
Disclosed are novel copper foils used as components of wireless charging systems. The copper foils can be laminated to produce flexible copper clad laminates, which can then be etched to form printed circuits (coils). The coils can be used as either, or both, of a receiver wireless charging circuit and/or a transmitter wireless charging circuit. Regulation of the chemical and physical properties of the copper foil produces higher efficiencies in the wireless charging system components.
Information query