Invention Grant
- Patent Title: Flexible printed circuit board and manufacturing method thereof
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Application No.: US14966099Application Date: 2015-12-11
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Publication No.: US09674969B2Publication Date: 2017-06-06
- Inventor: Chang-Jae Lee , Tae-Ho Ko , Jun-Ho Kang
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0182500 20141217
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; B23K26/364 ; H05K3/46 ; B23K26/06 ; B23K26/362 ; H05K1/18

Abstract:
A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.
Public/Granted literature
- US20160183363A1 FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-06-23
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