Invention Grant
- Patent Title: Cooling module
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Application No.: US14691283Application Date: 2015-04-20
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Publication No.: US09674982B2Publication Date: 2017-06-06
- Inventor: Ting-Ting He , Zhi-Ping Wu
- Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: HONG FU JIN PRECISON INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISON INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agent Steven Reiss
- Priority: CN201510042844 20150128
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/20 ; H01L23/467 ; H01L23/367 ; H01L21/48

Abstract:
A cooling module is used to cool an electronic component, the cooling module includes a shell and a radiator which is received in the shell. The shell includes a receiving portion which is used to receive the radiator. Two sides of the receiving include two latch pieces, the latch piece defines a latch hole. Two sides of the radiator include two protrusive blocks, the latch piece can be elastically deformed to let the protrusive block be inserted into the latch hole to fix the radiator in the shell.
Public/Granted literature
- US20160219753A1 COOLING MODULE Public/Granted day:2016-07-28
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