Invention Grant
- Patent Title: Tool-less air baffle
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Application No.: US14930052Application Date: 2015-11-02
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Publication No.: US09674983B2Publication Date: 2017-06-06
- Inventor: Chin-An Huang , Chen-Fa Wu , Shin-Chi Hsieh
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Jackson Walker L.L.P.
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
Public/Granted literature
- US20170127562A1 TOOL-LESS AIR BAFFLE Public/Granted day:2017-05-04
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