Invention Grant
- Patent Title: Dual purpose wireless device packaging
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Application No.: US14951288Application Date: 2015-11-24
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Publication No.: US09674985B1Publication Date: 2017-06-06
- Inventor: Seth Brandon Spiel
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Squire Patton Boggs (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02

Abstract:
In one embodiment, an apparatus includes: an antenna mount provided for an antenna; a first portion of an electrically conductive heat coupler provided for the antenna mount, wherein the first portion of the electrically conductive heat coupler reflects electromagnetic radiation associated with the antenna; and a second portion of the electrically conductive heat coupler electrically coupled to the first portion, where the second portion is shaped for arrangement in association with the placement of one or more electrical components on a substrate in order to draw heat away from at least one of the one or more electrical components and dissipate the heat over a combined surface area of the first and second portions of the electrically conductive heat coupler.
Public/Granted literature
- US20170150650A1 DUAL PURPOSE WIRELESS DEVICE PACKAGING Public/Granted day:2017-05-25
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