Invention Grant
- Patent Title: Devices and methods for cooling bus capacitors
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Application No.: US14603707Application Date: 2015-01-23
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Publication No.: US09674990B2Publication Date: 2017-06-06
- Inventor: Leonard J Davis
- Applicant: Leonard J Davis
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technoloies, Inc.
- Current Assignee: Rockwell Automation Technoloies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Quarles & Brady LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01G2/08 ; H01G4/38 ; H01G2/10 ; H01L23/473

Abstract:
An apparatus for cooling power components includes a first clamping portion, the first clamping portion having a first arcuate engagement surface, and a first interface. A second clamping portion, the second clamping portion having a second arcuate engagement surface, and a second interface. A flexible heat transfer pad and a power component. The power component is coupled to the flexible heat transfer pad, such that the flexible heat transfer pad substantially surrounds the power component, the first clamping portion and the second clamping portion configured to be coupled, such that the first arcuate engagement surface and the second arcuate engagement surface form an opening contoured to receive the power component, and the first interface and the second interface are adjacent to each other.
Public/Granted literature
- US20160219750A1 Devices and Methods for Cooling Bus Capacitors Public/Granted day:2016-07-28
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