Invention Grant
- Patent Title: Electromagnetic interference shielding film
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Application No.: US14674867Application Date: 2015-03-31
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Publication No.: US09674992B2Publication Date: 2017-06-06
- Inventor: Chen-Hsi Cheng
- Applicant: ITEQ CORPORATION
- Applicant Address: TW Taoyuan
- Assignee: ITEQ Corporation
- Current Assignee: ITEQ Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103123265A 20140707
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
The invention relates to an electromagnetic interference shielding film comprising an electromagnetic wave absorptive layer which contains electromagnetic wave absorptive particles; a conductive layer which contains conductive particles, and the conductive layer is disposed on a surface of the electromagnetic wave absorptive layer; a metallic layer disposed on another surface of the electromagnetic wave absorptive layer; and an insulating layer disposed on the metallic layer. The electromagnetic interference shielding film according to the invention can prevent the circuits and components from the electromagnetic interference.
Public/Granted literature
- US20160007510A1 ELECTROMAGNETIC INTERFERENCE SHIELDING FILM Public/Granted day:2016-01-07
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