Invention Grant
- Patent Title: Wafer edge trim blade with slots
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Application No.: US13408327Application Date: 2012-02-29
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Publication No.: US09676114B2Publication Date: 2017-06-13
- Inventor: Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
- Applicant: Chun-Ting Kuo , Kei-Wei Chen , Ying-Lang Wang , Kuo-Hsiu Wei
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: B26D1/143
- IPC: B26D1/143 ; B28D5/02 ; B24D5/02 ; B24D5/12 ; B23D61/02 ; B28D1/04 ; B26D7/18 ; B28D1/12
Abstract:
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
Public/Granted literature
- US20130220090A1 WAFER EDGE TRIM BLADE WITH SLOTS Public/Granted day:2013-08-29
Information query
IPC分类:
