Invention Grant
- Patent Title: Printbar and method of forming same
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Application No.: US15021522Application Date: 2013-09-20
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Publication No.: US09676192B2Publication Date: 2017-06-13
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- International Application: PCT/US2013/060828 WO 20130920
- International Announcement: WO2015/041665 WO 20150326
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/155

Abstract:
A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.
Public/Granted literature
- US20160221341A1 PRINTBAR AND METHOD OF FORMING SAME Public/Granted day:2016-08-04
Information query
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