Invention Grant
- Patent Title: Vehicle charging pad having reduced thickness
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Application No.: US14155638Application Date: 2014-01-15
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Publication No.: US09676285B2Publication Date: 2017-06-13
- Inventor: Steven Daniel Niederhauser , Nicholas Athol Keeling , Hanspeter Widmer , Markus Bittner
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Marten, Olson & Bear, LLP
- Main IPC: H01F3/08
- IPC: H01F3/08 ; B60L11/18 ; H01F38/14 ; H01F27/36 ; B60L3/00 ; B60L3/04 ; H01F27/30

Abstract:
This disclosure provides systems, methods and apparatus for charging pads for use with wireless power systems. In one aspect a vehicle charging pad having a reduced thickness is provided. A charging pad may include multiple wire coils and a ferrite block backing. By forming a longitudinally extending slot in the ferrite block, a portion of the wires extending from the coils can be routed through the slot in the ferrite block to decrease the overall thickness of the charging pad.
Public/Granted literature
- US20140327391A1 VEHICLE CHARGING PAD HAVING REDUCED THICKNESS Public/Granted day:2014-11-06
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