Invention Grant
- Patent Title: Shield conductive path
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Application No.: US14618120Application Date: 2015-02-10
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Publication No.: US09676348B2Publication Date: 2017-06-13
- Inventor: Hidetoshi Sugino , Masanori Kuwahara , Hidehiko Iwakawa
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Oliff PLC
- Priority: JP2014-040398 20140303
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H05K9/00 ; H01B7/17

Abstract:
A shield conductive path may include a tubular shield portion that surrounds a plurality of electric wires. The shield conductive path may further include a partition portion that partitions an interior space of the shield portion into a plurality of electrical wire insertion paths. A specific electrical wire may be inserted through a specific electrical wire insertion path of the plurality of electrical wire insertion paths and may be guided out from a guiding-out opening formed in the shield portion, to the outside of the shield portion, and this guiding-out opening can be formed within an area, of the shield portion, provided with the partition portion.
Public/Granted literature
- US20150246647A1 SHIELD CONDUCTIVE PATH Public/Granted day:2015-09-03
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