Invention Grant
- Patent Title: Supported resin substrate and method for producing the same and electronic device in which the supported resin substrate is used
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Application No.: US14719635Application Date: 2015-05-22
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Publication No.: US09676662B2Publication Date: 2017-06-13
- Inventor: Yuji Tanaka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-111328 20140529
- Main IPC: C03C17/42
- IPC: C03C17/42 ; H01L21/00 ; C23C14/08

Abstract:
A supported resin substrate comprises a supporting substrate, a release layer arranged on the supporting substrate and containing a metal or a metal oxide, and a resin substrate arranged on the release layer, the resin substrate including a front surface region opposite the release layer and a rear surface region in contact with the release layer. The resin substrate consists essentially of a resin material containing elemental fluorine. The ratio of the compositional proportion of fluorine in the rear surface region of the resin substrate to that in the front surface region of the resin substrate is 0.45 or less.
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