Invention Grant
- Patent Title: Curable encapsulants and use thereof
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Application No.: US14529438Application Date: 2014-10-31
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Publication No.: US09676928B2Publication Date: 2017-06-13
- Inventor: Yuxia Liu , Mark Konarski , Charles W. Paul , Peter D. Palasz
- Applicant: Henkel IP & Holding GmbH , HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C08L23/20
- IPC: C08L23/20 ; H01L51/52 ; H01B3/44 ; H01L51/44 ; H01L51/56 ; C08L23/22
Abstract:
The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.
Public/Granted literature
- US20150056757A1 CURABLE ENCAPSULANTS AND USE THEREOF Public/Granted day:2015-02-26
Information query
