Invention Grant
- Patent Title: Adhesive composition
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Application No.: US14897719Application Date: 2014-06-13
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Publication No.: US09676975B2Publication Date: 2017-06-13
- Inventor: Satoshi Kusuda , Yukihiko Murayama
- Applicant: Sekisui Fuller Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: SEKISUI FULLER COMPANY, LTD.
- Current Assignee: SEKISUI FULLER COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-125477 20130614; JP2013-263800 20131220
- International Application: PCT/JP2014/065801 WO 20140613
- International Announcement: WO2014/200100 WO 20141218
- Main IPC: C09J171/02
- IPC: C09J171/02 ; C09J163/00 ; C08G65/336 ; C08K9/04
Abstract:
The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide.
Public/Granted literature
- US20160122606A1 ADHESIVE COMPOSITION Public/Granted day:2016-05-05
Information query
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