Invention Grant
- Patent Title: Resin composition for sealing
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Application No.: US14331421Application Date: 2014-07-15
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Publication No.: US09676978B2Publication Date: 2017-06-13
- Inventor: Yuichi Kageyama
- Applicant: AJINOMOTO CO., INC.
- Applicant Address: JP Tokyo
- Assignee: AJINOMOTO CO., LTD.
- Current Assignee: AJINOMOTO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-006463 20120116
- Main IPC: C08F210/10
- IPC: C08F210/10 ; C09K3/10 ; C08L23/22 ; H01L51/56 ; C08L53/00 ; C08L63/00 ; H01L51/52

Abstract:
A sealing resin composition simultaneously having good transparency, resistance to moisture permeability, and adhesiveness resistant to heat and humidity, and a sealing resin composition sheet obtained therefrom. Using a resin composition containing (A) a styrene-isobutylene modified resin and (B) a tackifier resin as a sealing resin composition, a resin composition layer composed of the resin composition may be formed on a support to give a sealing resin composition sheet.
Public/Granted literature
- US20140323669A1 RESIN COMPOSITION FOR SEALING Public/Granted day:2014-10-30
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