Invention Grant
- Patent Title: Adhesive composition for heat dissipating adhesive tape, and heat dissipating adhesive tape
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Application No.: US15025542Application Date: 2015-03-16
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Publication No.: US09676986B2Publication Date: 2017-06-13
- Inventor: Ji-Hye Kim , Byung-Ho Ra , Jang-Soon Kim
- Applicant: LG Chem, Ltd.
- Applicant Address: KR
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2014-0034687 20140325
- International Application: PCT/KR2015/002522 WO 20150316
- International Announcement: WO2015/147470 WO 20151001
- Main IPC: C09K5/08
- IPC: C09K5/08 ; C09J7/02 ; C09J133/06 ; C09J9/00 ; C09K5/14
Abstract:
Provided is an adhesive composition for a heat dissipating adhesive tape, the adhesive composition comprising a (meth)acrylic acid ester based photocurable resin, a thermal conductive filler, and a benzotriazole-based compound.
Public/Granted literature
- US20160215195A1 ADHESIVE COMPOSITION FOR HEAT DISSIPATING ADHESIVE TAPE, AND HEAT DISSIPATING ADHESIVE TAPE Public/Granted day:2016-07-28
Information query
