A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising— a temperature-forcing head, including a face configured to be put in thermal contact with the device and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser and a metering device; wherein the subsystem is configured to circulate a bi-phase refrigerant, in closed loop fashion, through the evaporator so that, during circulation, the refrigerant is maintained at high pressure between the compressor and the metering device and at low pressure while flowing through the evaporator. More specifically, in the disclosed system the refrigerant, while flowing through the evaporator at a low pressure, is operative to dissipate heat therefrom by evaporation and the evaporator or any part thereof is formed as a heat exchanger.