The present disclosure is related to a microchip apparatus, where the microchip apparatus comprises a plurality of metallic layers. Each of the metallic layers may have a respective layer thickness. The microchip apparatus also comprises electronic components integrated within the metallic layers. The electronic components may be configured to communicate data. Further, the electronic components include an antenna feed. The microchip apparatus includes an antenna coupled to the antenna feed. The antenna includes multiple loops, each loop being formed by at least one layer of the metallic layers.