A structure includes an air bearing surface including a plurality of material layers arranged in at least one dimension on the air bearing surface. The structure further includes a microelectronic device and a resistive heating element, which each include at least one of the plurality of material layers. The resistive heating element is electrically isolated from the microelectronic device. The microelectronic device is heated by said resistive heating element. Optionally, a structure includes a tape reader or a tape writer, located at an air bearing surface. A resistive heating element is electrically isolated from the tape reader or writer and heats the tape reader or the tape writer. Optionally, a method includes identifying a microelectronic device located at an air bearing surface, identifying a resistive heating element, which is electrically isolated from the microelectronic device, applying a bias current through the resistive heating element to heat the microelectronic device.