One or more embodiments are directed to leadframes and leadframe semiconductor packages. One embodiment is directed to copper leadframes with one or more die pads and one more leads with a roughened surface. Covering the roughened surface of the die pad of the leadframe is nanolayer of Silver (Ag). The thickness of the nanolayer preferably has a thickness that corresponds to the roughened surface of the copper leadframe. For instance, in one embodiment, the copper leadframe is roughened to have peaks and valleys that approximately average 10 nanometers and the thickness of the nanolayer is 10 nanometers. Covering a portion of the nanolayer of Ag is a microlayer of Ag, which provides a suitable bonding surface for coupling a semiconductor die to the die pad by an adhesive material.