Invention Grant
- Patent Title: Package-on-package type package including integrated circuit devices and associated passive components on different levels
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Application No.: US13963598Application Date: 2013-08-09
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Publication No.: US09679853B2Publication Date: 2017-06-13
- Inventor: Jong-joo Lee
- Applicant: Jong-joo Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2012-0111389 20121008
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/538 ; H01L23/498 ; H01L25/10 ; H01L23/00
Abstract:
A package-on-package (PoP)-type package includes a first semiconductor package having a first passive element and a first semiconductor device mounted on a first substrate, and a second semiconductor package having a second semiconductor device mounted on a second substrate. The first passive element is electrically connected to the second semiconductor device. Related devices are also discussed.
Public/Granted literature
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