- Patent Title: Semiconductor arrangement comprising first semiconductor device and second semiconductor device that share active area and third semiconductor that shares another active area with first semiconductor device
-
Application No.: US15214809Application Date: 2016-07-20
-
Publication No.: US09679900B2Publication Date: 2017-06-13
- Inventor: Hsiao-Tsung Yen , Cheng-Wei Luo
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L27/092 ; H01L21/8238

Abstract:
A semiconductor arrangement and method of formation are provided. A semiconductor arrangement includes a first semiconductor device adjacent a second semiconductor device. The first semiconductor device includes a first gate over a first shallow well in a substrate. A first active area is in the first shallow well on a first side of the first gate. The second semiconductor device includes a second gate over a second shallow well. A third active area is in the second shallow well on a first side of the second gate. The second shallow well abuts the first shallow well in the substrate to form a P-N junction. The P-N junction increases capacitance of the semiconductor arrangement, as compared to a device without such a P-N junction.
Public/Granted literature
- US20160329334A1 SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF Public/Granted day:2016-11-10
Information query
IPC分类: