Invention Grant
- Patent Title: Molded enclosures having a seamless appearance
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Application No.: US15282768Application Date: 2016-09-30
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Publication No.: US09680249B2Publication Date: 2017-06-13
- Inventor: Peter A. Dvorak , Siri Amrit Ramos , Xuyang Zhang , Cesar Lozano Villarreal , Ciaran J. Keane , Alexander M. Kwan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend and Stockton, LLP
- Main IPC: H01R43/24
- IPC: H01R43/24 ; H01R31/06 ; H01R13/516 ; H01B17/64 ; H01R13/504 ; H01R43/18 ; H01R13/66
Abstract:
An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.
Public/Granted literature
- US20170093078A1 MOLDED ENCLOSURES HAVING A SEAMLESS APPEARANCE Public/Granted day:2017-03-30
Information query
