Invention Grant
- Patent Title: Multi-contact audio jack connector assembly
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Application No.: US14867739Application Date: 2015-09-28
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Publication No.: US09680264B2Publication Date: 2017-06-13
- Inventor: David J. Polinski
- Applicant: David J. Polinski
- Agency: McHale & Slavin, P.A.
- Main IPC: H01R24/58
- IPC: H01R24/58 ; H01R107/00 ; H01R103/00 ; H01R13/11 ; H01R105/00

Abstract:
Disclosed is an audio jack assembly that reduces or eliminates signal loss with an audio jack by reducing or eliminating the resistance with a conventional audio plug. The jack assembly employs a support housing having a passageway sized to receive the audio plug with an insulated first connector having first and second terminal strips, each formed integral to a first disk base and positioned to engage the grooved tip of an audio plug when engaged. A second isolated connector includes first and second terminal strips positioned to engage each side of a sleeve when the audio plug is engaged. The second connector is electrically isolated from the first connector wherein the second connector is fastened to the support housing securing the first connector therebetween.
Public/Granted literature
- US20170093098A1 Multi-Contact Audio Jack Connector Assembly Public/Granted day:2017-03-30
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