In one embodiment, a method for increasing potential data capacity for a high-density transceiver connector includes: aligning at least two transceiver-switch copper contacts opposite at least one network switch copper contact associated with a network switch, aligning at least two transceiver-cable copper contacts opposite at least one cable copper contact, and connecting the at least two transceiver-switch copper contacts to the at least two transceiver-cable copper contacts, wherein the high-density transceiver connector shares a form factor with a low-density transceiver connector.