Invention Grant
- Patent Title: Printed substrate and shield sheet metal fixing method
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Application No.: US15070659Application Date: 2016-03-15
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Publication No.: US09681544B2Publication Date: 2017-06-13
- Inventor: Takahiro Kitagawa
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Staas & Halsey LLP
- Priority: JP2015-091578 20150428
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A printed substrate includes: a substrate; a copper layer formed on the substrate; and a resin formed on the substrate to cover a part of the copper layer, wherein the copper layer includes a first region covered by the resin and a second region in which a shield sheet metal is installed, the shield sheet metal surrounding a predetermined region of the substrate, and wherein an angle formed between an outer edge portion of the copper layer covered by the resin and an outer edge portion of the resin which covers the copper layer at a location at which the outer edge portion of the copper layer and the outer edge portion of the resin intersect each other as viewed in plan is an obtuse angle.
Public/Granted literature
- US20160323990A1 PRINTED SUBSTRATE AND SHIELD SHEET METAL FIXING METHOD Public/Granted day:2016-11-03
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