Invention Grant
- Patent Title: Printed circuit board
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Application No.: US12258594Application Date: 2008-10-27
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Publication No.: US09681554B2Publication Date: 2017-06-13
- Inventor: Nan-Jang Chen
- Applicant: Nan-Jang Chen
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K3/22 ; H05K1/02

Abstract:
A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.
Public/Granted literature
- US20090253278A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-10-08
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