Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying a first polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.